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Journal Article

FAILURE ANALYSIS OF SOLDER JOINTS.

Insul Circuits (1978) 24(2) 19-23
DOI: 10.1007/978-981-15-3920-6_8
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Abstract

An explanation is presented of the preparation techniques necessary to prepare metallographic specimens that will furnish discernible and valuable data for the study of solder joint failures.

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APA

Bulwith, R. A. (1978). FAILURE ANALYSIS OF SOLDER JOINTS. Insul Circuits, 24(2), 19–23. https://doi.org/10.1007/978-981-15-3920-6_8

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