Smart-substrate: a novel structural design to avert residual stress accretion in directed energy deposition additive manufacturing

Abstract

Residual stresses, related distortions and cracks are detrimental in metallic Additive Manufacturing (AM). Previously developed stress-control strategies based on reducing thermal gradients hardly diminish the stress concentrations at the built basement and easily affect other physical phenomena involved in AM. To overcome this, a novel strategy, named as Smart-Substrate, consisting of optimising the inner structure and local stiffness of the substrate is proposed to avert stress accretion and related part deformations. To demonstrate its advantages, a coupled thermomechanical finite element model for AM, experimentally calibrated with in-situ temperature and displacement measurements, is employed to analyse the thermal and mechanical behaviour of three groups of different structures with increasing geometrical complexity (single-wall, rectangular and block parts) fabricated by Directed Energy Deposit (DED) on the standard and smart substrates, respectively. Through using Smart-Substrate, the generation of residual stresses, especially the stress concentrations at the bottom corner of DED-builds being highly sensitive to cracks, and the induced deflections, are fundamentally throttled, and contrariwise for the standard substrate. More importantly, the use of Smart-Substrate is almost without prejudice to the temperature field, metallurgy and resulting mechanical hardness. This provides a possibility for addressing different physical problems individually, enlarging the AM process window.