Dielectric and Thermal Properties of Epoxy Resin Nanocomposites Containing Polyhedral Oligomeric Silsesquioxane

Abstract

Epoxy resin nanocomposites based on 3,3', 5,5' -4,4' tetramethylbiphenyl diglycidyl epoxy resins (TMBP) were prepared through in situ co-polymerization with 4, 4'-diaminodiphenylsulfone (DDS) in the presence of octapropylglycidylether silsesquioxane (OGPOSS). The thermal properties of the TMBP/OGPOSS nanocomposite were analyzed by DSC and TGA. The glass transition temperature (T g) increased with increasing OGPOSS content. Additionally, the integrity of the epoxy networks was also demonstrated by thermal decomposition which occurred in one-step. The dielectric constant decreased with the increase of OGPOSS content. The morphology of TMBP/OGPOSS hybrids was characterized by Scanning Electron Microscopy (SEM).