Abstract
The commercialization of MEMS/NEMS devices is proceeding slower than expected, because the reliability problems of microscopic components differ from macroscopically known behavior. In this chapter, we provide an overview of the state of the art in MEMS/NEMS reliability. We discuss the specific, MEMS-related problems caused by stiction due to surface forces and electric charge. Materials issues such as creep and fatigue are treated as well. Nanoscale wear is covered briefly. MEMS packaging is also discussed, because the reliability of MEMS/NEMS components critically depends on the available protection from the environment.
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CITATION STYLE
van Spengen, W. M., Modliński, R., Puers, R., & Jourdain, A. (2017). Failure mechanisms in MEMS/NEMS devices. In Springer Handbooks (pp. 1437–1457). Springer. https://doi.org/10.1007/978-3-662-54357-3_40
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