Study of the behavior of shape memory polymers in the active disassembly process

Abstract

This paper reports on a research experience for a teacher in researching the behavior of shape memory polymers. The use of active disassembly using smart materials (ADSM) can be an alternative, with the potential to enable a broad range of electronic devices to be actively disassembled at the same time, reducing the cost of the manual labor or machine operation needed to disassemble the products. Shape memory polymers (SMP) are promising materials for this application. The main aim of the present study was to create SMP snap-fits and analyze the effect design parameters on the disassemble time. Six sets of snap-fits with different design parameters were manufactured form a commercial SMP Veritex. They were tested and the disassemble time was analyzed. According to the results, design parameters showed to have a slight influence in the disassemble time during the active disassemble process. A learning module based on the legacy cycle concept is being developed and it challenges students to think through new applications for the shape memory polymers. This learning module will be introduced into a high school mathematics class during the 2011-2012 school year. Assessment of the student's performance will be carried out and reported. © 2012 American Society for Engineering Education.