In the ever smaller silicon metal-oxide-semiconductor field-effect transistors of the present technology, electrons in the conductive channel are subject to increasingly stronger long-range Coulomb interactions with high-density electron gases present in the source, drain, and gate regions. We first discuss how two-dimensional, self-consistent full-band Monte Carlo/Poisson simulations can be tailored to reproduce correctly the semiclassical behavior of a high-density electron gas. We then employ these simulations to show that for devices with channel lengths shorter than about 40 nm and oxides thinner than about 2.5 nm, the long-range Coulomb interactions cause a significant reduction of the electron velocity, and so a degradation of the performance of the devices. In addition, the strong "thermalization" of the hot-electron energy distribution induced by Coulomb interactions has an effect on the expected reliability of the transistors. © 2001 American Institute of Physics.
CITATION STYLE
Fischetti, M. V., & Laux, S. E. (2001). Long-range Coulomb interactions in small Si devices. Part I: Performance and reliability. Journal of Applied Physics, 89(2), 1205–1231. https://doi.org/10.1063/1.1332423
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