The effect of increasing Sn content on High-Temperature mechanical deformation of an Mg-3%Cu-1%Ca alloy

Abstract

Chill casting of magnesium alloy samples with secondary alloying elements of Cu, Ca and Sn at % w.t. concentrations in the range 1–5, 0.1–5 and 0.1–3 respectively, gave rise to appreciably enhanced resistance to high-temperature creep, while maintaining good heat conductivity. The latter was considered to be driven by Cu and Mg-Cu intermetallics while it was clear that Sn mediated the high-temperature performance, mainly via networks of Mg2Sn and MgCaSn precipitates along the Mg matrix grain boundaries. It was postulated that Sn formed intermetallics by preferential substitution of Ca atoms and, thus, did not degrade the heat conductivity by retaining Cu. The % w.t. stoichiometry with the optimum combination of heat conductivity and resistance to high-temperature creep was found to be Mg-3Cu-1Ca-0.1Sn.