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The Effect of Zinc Addition on the Characteristics of Sn–2.0Ag–0.7Cu Lead-Free Solders

  • Mayappan R
  • Salleh A
Springer Singapore, (2018), 767-775
DOI: 10.1007/978-981-10-8471-3_75
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Mayappan, R., & Salleh, A. (2018). The Effect of Zinc Addition on the Characteristics of Sn–2.0Ag–0.7Cu Lead-Free Solders. In Proceedings of the Second International Conference on the Future of ASEAN (ICoFA) 2017 – Volume 2 (pp. 767–775). Springer Singapore. https://doi.org/10.1007/978-981-10-8471-3_75

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