Very low surface recombination velocity on p -type c -Si by high-rate plasma-deposited aluminum oxide

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Abstract

Aluminum oxide layers can provide excellent passivation for lowly and highly doped p -type silicon surfaces. Fixed negative charges induce an accumulation layer at the p -type silicon interface, resulting in very effective field-effect passivation. This paper presents highly negatively charged (Qox =-2.1× 1012 cm-2) aluminum oxide layers produced using an inline plasma-enhanced chemical vapor deposition system, leading to very low effective recombination velocities (∼10 cm s-1) on low-resistivity p -type substrates. A minimum static deposition rate (100 nm min-1) at least one order of magnitude higher than atomic layer deposition was achieved on a large carrier surfaces (∼1 m2) without significantly reducing the resultant passivation quality. © 2009 American Institute of Physics.

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Saint-Cast, P., Kania, D., Hofmann, M., Benick, J., Rentsch, J., & Preu, R. (2009). Very low surface recombination velocity on p -type c -Si by high-rate plasma-deposited aluminum oxide. Applied Physics Letters, 95(15). https://doi.org/10.1063/1.3250157

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