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Reliability, Yield, and Stress Burn-In

  • Kuo W
  • Chien W
  • Kim T
Springer US, (1998)
DOI: 10.1007/978-1-4615-5671-8
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Abstract

A Unified Approach for Microelectronics Systems Manufacturing & Software Development

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Kuo, W., Chien, W.-T. K., & Kim, T. (1998). Reliability, Yield, and Stress Burn-In. Reliability, Yield, and Stress Burn-In. Springer US. https://doi.org/10.1007/978-1-4615-5671-8

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