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Conference Proceedings

HIGH TEMPERATURE ORGANIC ADHESIVES.

Polymeric Materials Science and Engineering, Proceedings of the ACS Division of Polymeric Material (1987) 56 397-400
DOI: 10.1007/978-1-4613-0671-9_29
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Abstract

The paper discusses the relationship between high temperature properties and polymeric structure for several heterocyclic aromatic polymers used as adhesives; polybenzimidazoles, polyimides, polyquinoxalines, and other high temperature polymers.

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Chang, C. C. (1987). HIGH TEMPERATURE ORGANIC ADHESIVES. In Polymeric Materials Science and Engineering, Proceedings of the ACS Division of Polymeric Material (Vol. 56, pp. 397–400). ACS. https://doi.org/10.1007/978-1-4613-0671-9_29

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