Mechanics of Thin Film Structures

Abstract

Cracking of thin films on substrates due to indentation is discussed. Previous results have been reviewed leading to a relationship between crack pattern and material parameters of the film. Interface fracture under steady-state conditions between thin films and substrates at corners is discussed. Crack front shapes are shown and it is shown that this mode of delamination is more critical than the plane strain edge crack. Possible explanations for the so-called telephone cord mode of buckling driven delamination are given.