Thermal performance and reliability of processor investigation using TiO2 and cuo-water nanofluids

Abstract

Continuous miniaturization of feature size, faster operation and high-end per-formance of processor are facing serious problems to dissipate heat. In this nu-merical work, the surface temperature of the processor, heat transfer rate, power consumption and reliability of channel heat sink for processor handling TiO2--water and CuO-water nanofluids at three-volume fractions as a coolant are studied using CFD software package. The power dissipation of the Intel proces-sor was in the range of 16-135 W. The TiO2-water and CuO-water nanofluids at a volume fraction of 0.3%, 0.6%, and 0.9% was used as a coolant. It is observed that the heat transfer rate of CuO-water nanofluids at 0.3%, 0.6%, and 0.9% are 5%, 7%, and 9%, respectively, higher than that of TiO2-water nanofluid. It is found that the power consumption of the processor reduces by 2%, 3%, and 5% at the volume fraction of 0.3%, 0.6%, and 0.9%, respectively, than TiO2-water nanofluids as coolant. The failure rate of the processor using CuO-water nanofluid was found to be 17%, 10%, and 8% lesser than the TiO2-water nanofluids at the three-volume fractions, respectively.