Novel Low-Temperature CVD Process for Silicon Carbide MEMS

  • Stoldt C
  • Carraro C
  • Ashurst W
  • et al.
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Abstract

A low-temperature, single precursor CVD process for the realization of SiC-based MEMS and SiC-coated MEMS is described using 1,3-disilabutane. With this deposition method, the fabrication of an all-SiC cantilever beam array is demonstrated using standard microfabrication processes. Also, SiC coating of released Si micromechanical structures is realized using this process. The SiC-coated microstructures are shown to have superior chemical stability when compared to their Si analogs, as well as exhibit highly favorable mechanical properties.

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Stoldt, C. R., Carraro, C., Ashurst, W. R., Fritz, M. C., Gao, D., & Maboudian, R. (2001). Novel Low-Temperature CVD Process for Silicon Carbide MEMS. In Transducers ’01 Eurosensors XV (pp. 956–959). Springer Berlin Heidelberg. https://doi.org/10.1007/978-3-642-59497-7_226

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