Numerical Analysis of Heat Transfer and Fluid Flow in Mini-channel Heat Sink with Interconnecting Channels

Abstract

Augmentation of heat removal rate from an electronic device becomes an important viewpoint for enhancing the performance and lifetime of an electronic device. Overheating electronic devices may cause damage to hardware and software. Water-cooled Mini-channel heat sink (MCHS) is a profitable and basic cooling method for cooling of electronic equipments. In this research paper, three different mini-channels with differently configured interconnecting secondary channels heat sink geometry have been purposed and mathematical model is solved using finite volume method(FVM ) technique in ANSYS fluent solver has been used to investigate the problem numerically. Water is utilized as a coolant and streamflow is laminar, single phase in all setup of MCHS. The numerical outcomes demonstrate that minimum base plate temperature (BPT) of MCHS is observed at 10° secondary channel angle; hence, maximum performance of electronic device will be analyzed at 10° secondary channel angle.