It has been demonstrated experimentally that roughness changes contact angle (CA) in accordance with the Wenzel model or the Cassie-Baxter model, depending upon whether the surface is hydrophilic or hydrophobic (Bhushan and Jung 2011). Yost et al. (1995) found that roughness enhances wetting of a copper surface with Sn–Pb eutectic solder, which has a contact angle of 15°–20° for a smooth surface.
CITATION STYLE
Bhushan, B. (2018). Strategies for micropatterned, nanopatterned, and hierarchically structured lotus-like surfaces. In Springer Series in Materials Science (Vol. 279, pp. 121–197). Springer Verlag. https://doi.org/10.1007/978-3-319-71676-3_6
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