A novel sputtering technique: Inductively Coupled Impulse Sputtering (ICIS)

Abstract

Sputtering magnetic materials with magnetron based systems has the disadvantage of field quenching and variation of alloy composition with target erosion. The advantage of eliminating magnetic fields in the chamber is that this enables sputtered particles to move along the electric field more uniformly. Inductively coupled impulse sputtering (ICIS) is a form of high power impulse magnetron sputtering (HIPIMS) without a magnetic field where a high density plasma is produced by a high power radio frequency (RF) coil in order to sputter the target and ionise the metal vapour. In this emerging technology, the effects of power and pressure on the ionisation and deposition process are not known. The setup comprises of a 13.56 MHz pulsed RF coil pulsed with a duty cycle of 25 %. A pulsed DC voltage of 1900 V was applied to the cathode to attract Argon ions and initiate sputtering. Optical emission spectra (OES) for Cu and Ti neutrals and ions at constant pressure show a linear intensity increase for peak RF powers of 500 W-3400 W and a steep drop of intensity for a power of 4500 W. Argon neutrals show a linear increase for powers of 500 W-2300 W and a saturation of intensity between 2300 W-4500 W. The influence of pressure on the process was studied at a constant peak RF power of 2300 W. With increasing pressure the ionisation degree increased. The microstructure of the coatings shows globular growth at 2.95×10-2 mbar and large-grain columnar growth at 1.2×10-1 mbar. Bottom coverage of unbiased vias with a width of 0.360 μm and aspect ratio of 2.5:1 increased from 15 % to 20 % for this pressure range. The current work has shown that the concept of combining a RF powered coil with a magnet-free high voltage pulsed DC powered cathode is feasible and produces very stable plasma. The experiments have shown a significant influence of power and pressure on the plasma and coating microstructure. © Published under licence by IOP Publishing Ltd.