CITATION STYLE
Chiang, C. C., & Kawa, J. (2007). Systematic Yield - Chemical Mechanical Polishing (CMP). In Design for Manufacturability and Yield for Nano-Scale CMOS (pp. 99–150). Springer Netherlands. https://doi.org/10.1007/978-1-4020-5188-3_4
Mendeley helps you to discover research relevant for your work.