High performance UV and thermal cure hybrid epoxy adhesive

Abstract

New type one component UV and thermal curable hybrid epoxy adhesive was successfully developed. The hybrid epoxy adhesive is complete initiator free composition. Neither photo-initiator nor thermal initiator is contained. The hybrid adhesive is mainly composed of special designed liquid bismaleimide, partially acrylated epoxy resin, acrylic monomer, epoxy resin and latent curing agent. Its UV light and thermal cure behavior was studied by FT-IR spectroscopy and FT-Raman spectroscopy. Adhesive samples cured at UV only, thermal only and UV + thermal cure conditions were investigated. By calculated conversion rate of double bond in both acrylic component and maleimide compound, satisfactory light curability of the hybrid epoxy adhesive was confirmed quantitatively. The investigation results also showed that its UV cure components, acrylic and bismalimide, possess good thermal curability too. The initiator free hybrid epoxy adhesive showed satisfactory UV curability, good thermal curability and high adhesion performance.