Copper nanoparticles as nanofillers in an adhesive resin system: An in vitro study

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Abstract

Background. The incorporation of an antibacterial agent into an adhesive could improve its clinical per-formance. Some nanoparticles (NPs), including copper nanoparticles (Cu NPs), display an antibacterial effect. Therefore, Cu NPs could act as a nanofiller when added to an adhesive. Objectives. The aim of this study was to evaluate the antibacterial activity, cytotoxicity and shear bond strength (SBS) of an experimental dental adhesive with Cu NPs. Material and methods. Different concentrations (0.0050 wt%, 0.0075 wt% and 0.0100 wt%) of Cu NPs were added to the adhesive. The distribution of Cu NPs in the polymer matrix was observed based on transmission electron microscope (TEM) images. The antimicrobial activity of the adhesive + Cu NPs was evaluated with the agar disk diffusion test against Staphylococcus aureus (S. aureus), Escherichia coli (E. coli) and Streptococcus mutans (S. mutans). The cytotoxicity assay was performed by means of the MTT (3-(4,5-dimethylthiazol-2-yl)-2,5-diphenyltetrazolium bromide) method with human pulp cells (HPC). Additionally, the SBS tests were carried out (n = 31) and the modes of fracture were registered. The ves-tibular and lingual surfaces of each tooth were randomly assigned to the study groups (group I – control adhesive; group II – adhesive + 0.0100 wt% Cu NPs). The samples were statistically analyzed (p ≤ 0.05). Results. The adhesive + 0.0100 wt% Cu NPs showed inhibition zones against the strains under study that were similar to, or slightly smaller than, the halos produced by chlorhexidine (CHX) and specific drugs for each strain (30 μg of cefotaxime against S. mutans and S. aureus, and 1.25/3.75 μg of sulfamethoxazole/ trimethoprim against E. coli). The control adhesive was moderately cytotoxic (relative cell viability of 36.7 ±0.8%), being more cytotoxic than Cu NPs themselves (58.3 ±0.1%). A significantly higher SBS was obtained for the adhesive + 0.0100 wt% Cu NPs (6.038 ±2.95 MPa) than for the control group (3.278 ±1.75 MPa). The modes of fracture in group I were almost equally distributed between adhesive and cohesive failures whereas in group II, the failure was mainly cohesive. Conclusions. The results of this study suggest that incorporating Cu NPs into an adhesive improves its SBS and provides it with antibacterial properties, without in-creasing its inherent cytotoxicity – 2 desirable characteristics for the dental adhesives of composites.

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Torres-Rosas, R., Torres-Gómez, N., García-Contreras, R., Scougall-Vilchis, R. J., Domínguez-Díaz, L. R., & Argueta-Figueroa, L. (2020). Copper nanoparticles as nanofillers in an adhesive resin system: An in vitro study. Dental and Medical Problems, 57(3), 239–246. https://doi.org/10.17219/dmp/121973

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