Effective methods are required to solve three-dimensional solidification problems with fine meshes. This paper considers some of the problems associated with mapping control volume-based enthalpy algorithms onto vector processors and transputer-based parallel networks. Although vector processors may bring speedups of a factor of 5 or so, it appears that transputer-based networks have the facility to yield speedups that increase linearly with the number of transputer chips used. © 1989.
Cross, M., Johnson, S., & Chow, P. (1989). Mapping enthalpy-based solidification algorithms onto vector and parallel architectures. Applied Mathematical Modelling, 13(12), 702–709. https://doi.org/10.1016/0307-904X(89)90163-7