Silicon thinning and polishing on packaged devices

  • Beaudoin F
  • Perdu P
  • Desplats R
 et al. 
  • 2


    Mendeley users who have this article in their library.
  • 6


    Citations of this article.


Sample preparation with the ChipUnzip tool makes it possible to insure the functionality of packaged devices after opening. For debug and failure analysis, the silicon substrate needs to be thinned down to less than 50 microns while maintaining the functionality of the packaged device. This as proved to be very difficult on large dies. As we will present in this paper it is difficult to obtain a uniform silicon thickness after thinning due to some bending issues. Finally, we will present our fine polishing results, which represent a key issue for backside failure analysis. © 2001 Elsevier Science Ltd. All rights reserved.

Get free article suggestions today

Mendeley saves you time finding and organizing research

Sign up here
Already have an account ?Sign in

Find this document


  • F. Beaudoin

  • P. Perdu

  • R. Desplats

  • S. Rigo

  • D. Lewis

Cite this document

Choose a citation style from the tabs below

Save time finding and organizing research with Mendeley

Sign up for free