The Applications of DI-O3 Water on Wafer Surface Preparation

  • Chen G
  • 11


    Mendeley users who have this article in their library.
  • N/A


    Citations of this article.


Due to the continuously decreasing scale of integrated circuits (IC) and the increasing requirement in cost-of- ownership (CoO) reduction, throughput improvement and environmental friendliness, endeavor of developing innovative technologies in semiconductor device manufacturing has never ceased. Recent introduction of ozone technology in silicon wet cleaning processes to replace the conventional RCA methods has attracted interest from the industry but apparently deserves more attention for commercial utilization and implementation. In this paper, the application of ozonated DI water (DI-O3 water) in silicon wafer surface preparation, including removals of organic impurities, metallic contaminants and particles as well as photoresist stripping, is reviewed. The economic advantage of this technology in terms of the savings of chemicals and DI water is also briefly discussed.

Get free article suggestions today

Mendeley saves you time finding and organizing research

Sign up here
Already have an account ?Sign in

Find this document

There are no full text links


  • G Chen

Cite this document

Choose a citation style from the tabs below

Save time finding and organizing research with Mendeley

Sign up for free