Effects of direct and pulse current on copper electrodeposition through photoresist molds

  • Quemper J
  • Dufour-Gergam E
  • Frantz-Rodriguez N
 et al. 
  • 19


    Mendeley users who have this article in their library.
  • 17


    Citations of this article.


In this paper, electrodeposition of copper films and copper lines with direct and pulse currents is compared. In the first step, electrical and physicochemical characterizations of the copper films are realized, and the optimized electrodeposition parameters are so determined. The use of pulse reverse current is also investigated. In the second step, these parameters are applied to micromolding. Copper lines are electro-deposited and compared in order to determine the more suitable current mode for micromolding.

Get free article suggestions today

Mendeley saves you time finding and organizing research

Sign up here
Already have an account ?Sign in

Find this document


  • Jean Marie Quemper

  • Elisabeth Dufour-Gergam

  • Nadège Frantz-Rodriguez

  • Jean Paul Gilles

  • Jean Paul Grandchamp

  • Alain Bosseboeuf

Cite this document

Choose a citation style from the tabs below

Save time finding and organizing research with Mendeley

Sign up for free