Effects of direct and pulse current on copper electrodeposition through photoresist molds

Abstract

In this paper, electrodeposition of copper films and copper lines with direct and pulse currents is compared. In the first step, electrical and physicochemical characterizations of the copper films are realized, and the optimized electrodeposition parameters are so determined. The use of pulse reverse current is also investigated. In the second step, these parameters are applied to micromolding. Copper lines are electro-deposited and compared in order to determine the more suitable current mode for micromolding.