Many-core design from a thermal perspective

  • Huang W
  • Stan M
  • Sankaranarayanan K
 et al. 
  • 30

    Readers

    Mendeley users who have this article in their library.
  • 74

    Citations

    Citations of this article.

Abstract

Air cooling limits have been a major design challenge in recent years for integrated circuits. Multi-core exacerbates thermal challenges because power scales with the number of cores, but also creates new opportunities for temperature-aware design, because multi-core designs offer more design parameters than single-core designs. This paper investigates the relationship between core size and on-chip hot spot temperature and shows that with the same power density, smaller cores are cooler than larger cores due to a spatial low-pass filtering effect of temperature. This phenomenon suggests that designs exploiting low-pass filtering can dissipate more power within the same cooling budget than contemporary designs.

Author-supplied keywords

  • Many-core design
  • Performance
  • Temperature
  • Thermal design power

Get free article suggestions today

Mendeley saves you time finding and organizing research

Sign up here
Already have an account ?Sign in

Find this document

Authors

Cite this document

Choose a citation style from the tabs below

Save time finding and organizing research with Mendeley

Sign up for free