Air cooling limits have been a major design challenge in recent years for integrated circuits. Multi-core exacerbates thermal challenges because power scales with the number of cores, but also creates new opportunities for temperature-aware design, because multi-core designs offer more design parameters than single-core designs. This paper investigates the relationship between core size and on-chip hot spot temperature and shows that with the same power density, smaller cores are cooler than larger cores due to a spatial low-pass filtering effect of temperature. This phenomenon suggests that designs exploiting low-pass filtering can dissipate more power within the same cooling budget than contemporary designs. Copyright 2008 ACM.
CITATION STYLE
Huang, W., Stan, M. R., Sankaranarayanan, K., Ribando, R. J., & Skadron, K. (2008). Many-core design from a thermal perspective. In Proceedings - Design Automation Conference (pp. 746–749). https://doi.org/10.1109/DAC.2008.4555918
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