Haptic based optimized path planning approach to virtual Maintenance Assembly / Disassembly (MAD)

Abstract

In virtual MAD environment the most significant phase is the A/D process (Assembly / Disassembly). The effectiveness of the maintenance scheme depends on the A/D sequence, number of gripper changes and the path used in an A/D procedure. However, in a constrained 3D environment simulating realistic models, path planning of the parts becomes more complex because of the factors like complex geometry computations, obstacles, orientation and initial/final position of the part. In this case the path planning of the parts becomes an important factor affecting the overall efficiency of the maintenance process. Therefore, to address this problem an intelligent assembly planner is developed with a combined approach based on potential field method and genetic optimization process for MAD path planning. Furthermore, haptic-assisted feature is implemented for user support for realistic 3D MAD path planning simulations. ©2010 IEEE.