Abstract
His paper focuses on the Burn-in Screening Technology of Power Bare Die. A temporary carrier that allows the power bare die full temperature testing and burn-in has been described. A suitable improvement multi-bump contact carrier technology has been put forward and Experiment results have shown that the contact resistance of the new carrier decrease 40% significantly. Base on the peak value junction temperature controlling, A more effective power bare die pulse full power burn-in screening technology have been proposed, which power bare dies would be burn-in screened by 100%. So the high quality and reliability requirements for bare power die of MCM and SiP are met. © 2010 IEEE.
Cite
CITATION STYLE
Huang, Y., Yang, S., En, Y., & Feng, Y. (2010). Burn-in screening technology of power bare die. In Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010 (pp. 1255–1258). https://doi.org/10.1109/ICEPT.2010.5582780
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