A de-embedding technique for interconnects

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Abstract

In general, three parameters are needed to model symmetrical adapters, but not enough equations can be found to solve them. The measurement of through adapters gives two conditions only, but neither open nor short adapter gives any useful condition. The results from lines with length L and length 2L can be used to derive the result for through adapters. This paper proposes one approach with a 2-impedance model, which has one shunt impedance and one series impedance. This model can be used with more complicated structures than the single impedance model.

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Song, J., Ling, F., Flynn, G., Blood, W., & Demircan, E. (2001). A de-embedding technique for interconnects. In IEEE Topical Meeting on Electrical Performance of Electronic Packaging (pp. 129–132). https://doi.org/10.1109/epep.2001.967628

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