Abstract
It was found that GaAs was etched effectively by atomic hydrogen generated by a tungsten (W) filament. The experiment was performed in a pure H2 gas or H2 and He gas mixture at atmospheric pressure. The W-filament was heated up to 2000°C. The GaAs was etched with a smooth surface in pure H2 gas and the etching rate was as high as 15 gm/h at a substrate temperature of 850°C, though the etching rate was low and the surface was rough with Ga droplets in He gas. These results suggest that Ga is removed from the GaAs surface as a hydride such as GaH3. © 1991 The Japan Society of Applied Physics.
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Kobayashi, R., Fujii, K., & Fiasegawa, F. (1991). Etching of gaas by atomic hydrogen generated by a tungsten filament. Japanese Journal of Applied Physics, 30(8), L1447–L1449. https://doi.org/10.1143/JJAP.30.L1447
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