Modeling of electronic and mechanical dimensioning of an exoskeleton bottom for bipedal gait

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Abstract

This document refers to the modeling of the electronic and mechanical design of an exoskeleton part for the rehabilitation of people who have suffered a level of injury due to some type of accident, according to CONADIS (Consejo Nacional para la Igualdad de Discapacidades), the statistics of disability in Ecuador registers a total of 415.5 thousand people who have some type of disability, of which there are 196,076 thousand people with physical disabilities2among them are persons with inability to walk and therefore need to undergo therapies; This reality motivates the design of a structure (exoskeleton) that supports and helps the reinsertion of these people into daily life using an ergonomic, comfortable, and safe therapeutic support instrument. The modeling of the lower part exoskeleton is made based on the anthropometry, kinetics and kinetics of the bipedal walk, with a rigorous analysis of stresses and deformations; Contain mechanical telescopic adjustments at the articulations between the hipknee and knee-ankle points for adaptation [1], that the angular ranges of articulation are defined by values of each actuator added to mechanical stops to avoid dislocations to the patient; It is powered by a battery with high performance and long duration, have feedback sensors to control the desired position. Its engines are lightweight, fast, low-power, coupled with suitable digital controllers, whose transfer function is calculated and serves to process the variables of the PID controller. This research will give way to future research concerning the completion of the actual construction of the prototype to be subjected to final tests and start mass production at more reasonable cost and can reach a greater number of people with limited resources.

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Luis, S. A., Francisco, I., William, C., & Eduardo, P. V. (2018). Modeling of electronic and mechanical dimensioning of an exoskeleton bottom for bipedal gait. In Advances in Intelligent Systems and Computing (Vol. 590, pp. 315–323). Springer Verlag. https://doi.org/10.1007/978-3-319-60483-1_31

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