Three-dimensional stacked multilayer graphene interconnects

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Abstract

We experimentally demonstrate stacked multilayer graphene (MLG) (s-MLG) as a new material system for high-performance carbon interconnects. Electrical performance is systematically characterized. We discover that the wire sheet resistance of s-MLG decreases with more layers stacking and shows better conductivity than that of the exfoliated MLG sample with the same layer numbers. The contact resistance of the s-MLG samples was calculated and confirmed using two different methods. It is demonstrated that a decrease in the intrinsic resistivity of s-MLG with increasing layer number is discovered; however, contact resistance will be saturated with more stacked layer numbers. © 2011 IEEE.

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Yu, T., Liang, C. W., Kim, C., Song, E. S., & Yu, B. (2011). Three-dimensional stacked multilayer graphene interconnects. IEEE Electron Device Letters, 32(8), 1110–1112. https://doi.org/10.1109/LED.2011.2158385

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