A method for substrate permittivity and dielectric loss characterization up to subterahertz frequencies

Abstract

In this paper, a method for substrate permittivity and loss tangent characterization applicable for frequencies in the subterahertz range is presented. Planar transmission lines fabricated on three different printed circuit board (PCB) materials and four different on-chip/on-wafer materials are being used for measurement along with a wafer probing station equipped with on-wafer probes and frequency extenders. A comprehensive procedure for calculation of substrate permittivity, total loss, characteristic impedance, and dielectric loss tangent is presented. Measurement data up to 67 GHz is given in case of PCB and up to 500 GHz in case of on-chip/on-wafer materials and compared against reference data and competitive materials from recent publications.