Improving diamond-metal adhesion with graded TiCN interlayers

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Abstract

An approach improving diamond-metal adhesion has been developed based on modeling predictions and experimental verifications on the interfacial stresses modified by catalytic reaction. It is found that N-plasma irradiating onto Ti and tungsten-carbide substrates generates tensile surface stresses while C-plasma irradiation creates strongly compressive stress at the surfaces, both of which deteriorate the diamond-metal adhesion. It is also found that surface oxidation prevents diamond nucleation. Therefore, we applied a graded TiCN interlayer with carefully adjusting the ratio of C and N in the gas mixture to neutralize the interfacial stress and, hence, we have improved the diamond-metal adhesion substantially. © 2002 American Institute of Physics.

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Sun, C. Q., Fu, Y. Q., Yan, B. B., Hsieh, J. H., Lau, S. P., Sun, X. W., & Tay, B. K. (2002). Improving diamond-metal adhesion with graded TiCN interlayers. Journal of Applied Physics, 91(3), 2051–2054. https://doi.org/10.1063/1.1434546

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