A CNN-Based transfer learning method for defect classification in semiconductor manufacturing

Abstract

In this paper, we focus on a defect analysis task that requires engineers to identify the causes of yield reduction from defect classification results. We organize the analysis work into three phases: defect classification, defect trend monitoring and detailed classification. To support the first and third engineer's analytical work, we use a convolutional neural network based on the transfer learning method for automatic defect classification. We evaluated our proposed methods on real semiconductor fabrication data sets by performing a defect classification task using a scanning electron microscope image and thoroughly examining its performance. We concluded that the proposed method can classify defect images with high accuracy while lowering labor costs equivalent to one-third the labor required for manual inspection work.