A time delay multiple integration linear CMOS image sensor for multispectral satellite telemetry

Abstract

This paper presents a time delay multiple integration (TDMI) linear CMOS image sensor for multispectral satellite telemetry. With the proposed hybrid structure of analog and digital accumulation, the implemented time delay multiple integrator integrates the functions of TDI, multiple sampling (MS), and analog-to-digital conversion in a single chip. An 8 × 128 linear CMOS image sensor prototype was fabricated in 0.18-μm 1P6M 1.8 V CMOS technology. With an operation of ×8 TDI, ×64 MS, and a line time of 414.72 μs, the measured sensitivity, SNR improvement, and power consumption are 40.42 V/lux-s, 9.37 dB, and 17.77 mW, respectively.