Enhanced thermal and microstructure properties of Sn-1.0Ag-0.7Cu based lead-free solder with Titanium Oxide addition

Abstract

This paper presented the effects on thermal and microstructure properties of Sn-1.0Ag-0.7Cu (SAC107) lead-free solder alloy with the addition of titanium oxide (TiO2) particles. The SAC107 solders were reinforced with 0.25, 0.5, 0.75 and 1.0 weight percentage (wt.%) of titanium oxide (TiO2) particles to produce SAC107+TiO2 solder alloy composite. The solder alloy was prepared by microwave-assisted powder metallurgy route. Based on the results, it showed that the addition of TiO2 particles influenced the properties of the solder alloy composite by refining the intermetallic compound (IMC) at the bulk microstructure area and slightly decreasing the melting temperature.