Abstract
The evaluation of strength as well as failure behavior of adhesively bonded structures is essential to further improvement of their applicability. Since adhesively bonded structures are very poor in resisting peel loading, designers of these joints usually avoid subjecting these structures to peel loadings. However, in some circumstances, designers fail to avoid peel stressing in their designed structures. The aim of the present work is to enhance peel resistance of adhesively bonded structures in order to confront inevitable situations that bonded structures are subject to peel loading, without adding extra weight to the design.
Cite
CITATION STYLE
Ameen, W., Darwish, S. M., & Al Samhan, A. (2015). Towards enhancing peel strength of adhesively bonded joints. In IOP Conference Series: Materials Science and Engineering (Vol. 87). Institute of Physics Publishing. https://doi.org/10.1088/1757-899X/87/1/012004
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