Abstract
Time-pressure dispensing has been widely employed in electronics packaging manufacturing, where the fluid (such as encapsulant, epoxy, adhesive, etc.) in a syringe is driven by pressurized air and delivered onto boards or substrates. In such a process, the flow rate dynamics is critical in controlling the amount of fluid dispensed, yet extremely difficult to represent due to its complex behavior. This paper presents the development of a model of the flow rate dynamics in time-pressure dispensing, taking into account both air compressibility and fluid inertia. Experiments have been conducted to verify the effectiveness of the model developed.
Cite
CITATION STYLE
Chen, X. B., Schoenau, G., & Zhang, W. J. (2002). On the flow rate dynamics in time-pressure dispensing processes. Journal of Dynamic Systems, Measurement and Control, Transactions of the ASME, 124(4), 693–698. https://doi.org/10.1115/1.1514058
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