Optimization of injection flow rate to minimize micro/macro-voids formation in resin transfer molded composites

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Abstract

Resin transfer molding (RTM) has become one of the most widely used processes to manufacture medium size reinforced composite parts. To further enhance the process yield while ensuring the best possible quality of the produced parts, physically based optimization procedures have to be devised. The filling of the mold remains the limiting step of the whole process, and the reduction of the filling time has an important impact on the overall cost reduction. On the other hand, the injection cycle has to be appropriately carried out to ensure a proper fiber impregnation. Indeed, a partial fiber impregnation leads to the creation of micro-scopic and macro-scopic voids. In the present work, based on a double scale flow model and the capillary number Ca, an optimization algorithm is proposed to minimize the micro/macro-voids in RTM composite parts. The optimized injection flow rate ensures an optimum Ca at the flow front during part filling. The implemented algorithm allows the use of various constraints such as maximum capabilities of the injection equipment (i.e., maximum pressure or flow rate at the injection gates) or maximum velocity to avoid fiber washing. Bounded by these constraints, the optimization procedure is devised to handle any injection configuration (i.e., injection gates or vents locations) for two or three-dimensional parts. The numerical model is based on a mixed (FE/CV) formulation that uses non-conforming elements to ensure mass conservation. The proposed algorithm is tested for two and three-dimensional parts while emphasizing the important void reduction that results from the optimized injection cycle. © 2005 Published by Elsevier Ltd.

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APA

Ruiz, E., Achim, V., Soukane, S., Trochu, F., & Bréard, J. (2006). Optimization of injection flow rate to minimize micro/macro-voids formation in resin transfer molded composites. Composites Science and Technology, 66(3–4), 475–486. https://doi.org/10.1016/j.compscitech.2005.06.013

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