Optimized Performance of Piezo-Driven Jet Actuator for Thixotropic Epoxies in Electronics Assembly

Abstract

The electronic assembly industry’s growing need for advanced packaging and miniaturization calls for a more automated, regulated process with higher units per hour and tighter tolerance levels. This article deals with an advanced low-volume fluid dispensing process on various substrates using new jet dispensing technology on a faster and more accurate platform. Jetting has been widely used to jet out material in small quantities for various purposes. By striking a piston over a seat, jetting technology helps dispense fluid droplets from the nozzle tip and propagate them toward the substrate in a precise volume A new jet dispensing valve with a piezoelectric base improves performance and stability over time by depositing thixotropic adhesive materials within tighter tolerances in smaller volumes. One noticeably clear advantage is the ability to control the droplet size as a function of piston lift with good volume control. The ability to deposit small masses consistently and precisely, with droplet placement accuracy is determined by the relationship between the commanded and actual positions in two-dimensional spaces, which is what defines performance. The new feed-forward control piezo-driven jet valve hardware, which demonstrates faster performance with necessary valve stability equivalent to the assembly production environment, resolves two major challenging factors: dispense accuracy and throughput. This article addresses dispensing requirements like droplet dispense quality, droplet placement accuracy, droplet circularity, and line dispense quality.