Microwave-assisted Ullmann-Buchwald C-S bond formation using a copper(I) catalyst and trans-cyclohexane-1,2-diol as ligand

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Abstract

Microwave irradiation of a thiophenol or alkyl thiol (1 equiv.) and an aryl halide (1 equiv.) in 2-propanol at 120°C for three hours in the presence of K2CO3 (2 equiv.) as base using copper(I) iodide as catalyst (5 mol%) and trans-cyclohexane-1,2-diol (2 equiv.) as ligand provides a rapid and convenient method for C-S bond formation. The process is most efficient using thiophenol and aryl iodide precursors, both of which may contain electron-donating and electronwithdrawing groups, to give the corresponding diaryl sulfide in good to excellent yield. © ARKAT-USA, Inc.

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Bagley, M. C., Fusillo, V., Hills, E. G. B., Mulholland, A. T., Newcombe, J., Pentecost, L. J., … Turrell, C. C. (2012). Microwave-assisted Ullmann-Buchwald C-S bond formation using a copper(I) catalyst and trans-cyclohexane-1,2-diol as ligand. Arkivoc, 2012(7), 294–313. https://doi.org/10.3998/ark.5550190.0013.720

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