Micromechanical Properties of Solder Joint Towards Air Blast Exposure

Abstract

In modern war fighting and conflict prevention, the important of electronics has been and continues to be the fastest moving in technology areas. The key process in industrial manufacture of electronic device is soldering. Sn-Ag-Cu solder have been recommended to replace Sn-Pb solder in the chip-joint process because of low cost and large volume consumer product. In order to study the micromechanical properties of SAC 0307, the blast test was conducted using 500 g and 1000 g of trinitrotoluene (TNT) and the samples were fixed to two meter distance. The effect of micromechanical properties of SAC 0307 were investigated using nanoindentation technique. The hardness and reduced modulus of SAC 0307 were decreased while the plastic work increased when the source of blast increased. The characterization especially after air blast exposure in order to accurately predict the reliability of solder joints there were very large discrepancies in both the tensile and creep properties provided in Sn-Ag-Cu current databases.