On-chip hybrid integration of swept frequency distributed-feedback laser with silicon photonic circuits using photonic wire bonding

  • Chowdhury S
  • Wickremasinghe K
  • Grist S
  • et al.
4Citations
Citations of this article
18Readers
Mendeley users who have this article in their library.
Get full text

Abstract

This paper presents a novel co-packaging approach through on-chip hybrid laser integration with photonic circuits using photonic wire bonding. The process involves die-bonding a low-cost semiconductor distributed-feedback (DFB) laser into a deep trench on a silicon-on-insulator (SOI) chip and coupling it to the silicon circuitry through photonic wire bonding (PWB). After characterizing the power-current-voltage (LIV) and optical spectrum of the laser, a wavelength-current relationship utilizing its tunability through self-heating a swept-frequency laser (SFL) is developed. Photonic integrated circuit (PIC) resonators are successfully characterized using the SFL method, demonstrating signal detection with a quality factor comparable to measurements conducted with an off-chip benchtop laser.

Cite

CITATION STYLE

APA

Chowdhury, S. J., Wickremasinghe, K., Grist, S. M., Zou, H., Mitchell, M., Al-Qadasi, M. A., … Chrostowski, L. (2024). On-chip hybrid integration of swept frequency distributed-feedback laser with silicon photonic circuits using photonic wire bonding. Optics Express, 32(3), 3085. https://doi.org/10.1364/oe.510036

Register to see more suggestions

Mendeley helps you to discover research relevant for your work.

Already have an account?

Save time finding and organizing research with Mendeley

Sign up for free