Structural and Random Vibration Analysis of LEDs Conductive Polymer Interconnections

Abstract

Many devices consist of electronic parts and can be operated in a certain vibration environment for some instant without undergoing failure. Interconnection or joint plays a very important role in electronic devices to connect various electrical and mechanical parts altogether. The main objective of this study is to investigate the effect of interconnection performance under vibration loading in terms of natural frequency, mode shapes and transfer function. Four different models of LEDs are built for pull strength and vibration tests. The structural analysis of these models are carried out by using universal testing machine. The dynamic responses of four build matrices under certain random frequency are observed by random vibration analysis. In structural analysis, the samples are subjected to vertical displacement loading while in random vibration analysis, the models run in a frequency range of 3 Hz to 500 Hz. It is observed that the structure of the adhesive joints affect the strength of interconnection between circuit pad and LED joints. Furthermore, FEA analysis is also carried out to determine the stresses at solder joint under vibration condition. The models are excited from natural frequency and good comparison of the experimental results and FEA analysis are observed.