Abstract
The microstructures and the phase transformation temperatures of sputtered titanium-nickel (TiNi) thin films, both free-standing and attached on different underlying multi-layer substrates, have been studied. Differences in the microstructures, such as the lattice constants and relative concentrations of TiNi, Ti 2Ni and TiNi 3 phases, have been observed among the free-standing and the attached films, among the films attached on different underlying multi-layers and among the films with different relative orders of ageing and release. Not surprisingly, the corresponding phase transformation temperatures are also different. It is proposed that both process- and substrate-induced stresses affect the microstructures, hence the phase transformation characteristics, of the resulting shape-memory thin films.
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CITATION STYLE
Wang, R. X., Zohar, Y., & Wong, M. (2001). The effects of process-induced stress on the microstructures and the phase transformation characteristics of sputtered titanium-nickel thin-film shape-memory alloys. Journal of Micromechanics and Microengineering, 11(6), 686–691. https://doi.org/10.1088/0960-1317/11/6/309
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