Multilayer packaging dual-band balanced bandpass filter based on dual-mode substrate integrated waveguide cavities with split-type topology

Abstract

A new design method of the dual-band balanced bandpass filter (BPF) using multilayer packaging dual-mode substrate integrated waveguide (SIW) cavities is proposed. Split-type coupling topology based on dual-mode resonators is developed for the design. Firstly, a single-band balanced filter with perturbed metal vias is designed. The TE201 mode and the TE202 mode perturbed by the metal vias can form a passband. Secondly, an additional metal vias perturbed SIW cavity with the same dual-mode is placed in the lower layer for the bandstop function. A dual-band balanced BPF with split-type coupling topology is successfully realised. Compared with the traditional cascaded single-mode form, the proposed dual-mode split-type design has more compact size and can be more easily extended to multi-passbands. To verify the proposed method, a dual-band balanced filter operating at 13.3 and 14.2 GHz is designed, fabricated and measured. The designed dual-band balanced filter has good filtering performance including differential mode passband transmission and common mode rejection. Measured results show good agreements with simulated ones.