Nanoelectrode lithography: Chemical nanoimprint that transfers a pattern by electrochemical reaction

Abstract

This paper introduces nanoelectrode lithography, which is a pattern duplication method that combines nanoimprint with an electrochemical reaction. The conductive mold pattern undergoes an electrochemical reaction that enables an oxide pattern to be fabricated directly on the surface of a semiconductor or metal layer. Since this technique transfers the mold pattern to a target surface chemically, it is categorized as chemical nanoimprint, while conventional nanoimprint physically transfers a mold pattern having peaks and valleys to the target. This patterning phenomenon gives nanoelectrode lithography some advantages such as resistless patterning and multiple patterning, which will improve the accuracy and flexibility of nanoimprint. This paper describes these characteristics and the development of a conductive mold and nanoimprint tool for applying this patterning approach to future device production.