Innovative use of wood-plastic-composites (WPC) as a core material in the sandwich injection molding process

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Abstract

The demand for materials based on renewable raw materials has risen steadily in recent years. With society's increasing interest for climate protection and sustainability, natural-based materials such as wood-plastic-composites (WPC) have gained market share thanks to their positive reputation. Due to advantages over unreinforced plastics such as cost reduction and weight savings it is possible to use WPC in a wide area of application. Additionally, an increase in mechanical properties such as rigidity and strength is achieved by the fibers compared to unreinforced polymers. The combination of plastic and wood combines the positive properties of both components in an innovative material. Despite the many positive properties of wood-plastic-composite, there are also negative characteristics that prevent the use of WPC in many product areas, such as automotive interiors. In particular, increased water intake, which may result in swelling of near-surface particles, increased odor emissions, poor surface textures and distortion of the components are unacceptable for many applications. The sandwich injection molding process can improve this situation by eliminating the negative properties of WPC by enclosing it with a pure polymer. In this case, a layered structure of skin and core material is produced, wherein the core component is completely enclosed by the skin component. The suitability of WPC as the core component in the sandwich injection molding has not yet been investigated. In this study the possibilities and limitations of the use of WPC are presented. The consideration of different fiber types, fiber contents, skin materials and its effect on the filling behavior are the focus of the presented analysis.

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Moritzer, E., & Martin, Y. (2016). Innovative use of wood-plastic-composites (WPC) as a core material in the sandwich injection molding process. In AIP Conference Proceedings (Vol. 1713). American Institute of Physics Inc. https://doi.org/10.1063/1.4942270

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