Abstract
Test cost is becoming a more and more significant portion of the cost structure in advanced semiconductor products. To address this issue, we propose HOY - a novel wireless test system with enhanced embedded test features. We present the concept, architecture, and test flow for future semiconductor products tested by HOY. Necessary technologies for the success of HOY also are presented, though most of which require further investigation. A preliminary demonstration system has been constructed, and experiments are being conducted. © 2006 IEEE.
Cite
CITATION STYLE
Wu, C. W., Huang, C. T., Huang, S. Y., Huang, P. C., Chang, T. Y., & Hsing, Y. T. (2007). The HOY tester - Can IC testing go wireless? In 2006 International Symposium on VLSI Design, Automation and Test, VLSI-DAT 2006 - Proceedings of Technical Papers (pp. 183–186). https://doi.org/10.1109/VDAT.2006.258155
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