Modular hardware platform for the development of IoT devices implemented using multi-chip packaging technology

Abstract

The paper presents the concept of a modular hardware platform for the development of IoT devices using the example of a system for collecting and analyzing information. Design variants of modules that implement the basic functions of IoT devices are presented: obtaining primary data and their preliminary processing, data aggregation and transmission, data analysis and storage of results. The technologies of multi-chip packaging and three-dimensional integration are presented, which can significantly reduce the size of the developed modules.